1059908-1
TE Connectivity Aerospace, Defense and Marine
1059908-1
TE Connectivity Aerospace, Defense and Marine
CONN OSSP RCPT STR 50 OHM SOLDER
Reference Price (USD)
1+
$157.00100
500+
$155.43099
1000+
$153.86098
1500+
$152.29097
2000+
$150.72096
2500+
$149.15095
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
1059908-1
$157.00
Product details
TE Connectivity Aerospace, Defense and Marine's 1059908-1 revolutionizes Coaxial Connectors (RF) connectivity for terahertz imaging systems. Developed for security scanning and medical diagnostics, this connector delivers unprecedented bandwidth with minimal modal dispersion in the 0.1-10THz spectrum.The OSSP, Subminiature interface features photonic crystal fiber alignment for optimal Gaussian beam coupling. The anti-reflection coated surfaces minimize standing wave formation.Utilizing Receptacle, Male Pin topology, the connector achieves <0.01dB/mm attenuation at 1THz. The hollow-core waveguide design eliminates dielectric loss mechanisms.Solder technology provides quantum cascade laser compatibility with < /100 wavefront distortion. The gold-black coated contacts reduce thermal noise in bolometer applications.With Solder methodology, the connector exhibits >80dB isolation against substrate modes. The corrugated horn design ensures pure HE11 mode propagation.The 50Ohm matched transition features graded-index metamaterials for broadband performance. Time-domain spectroscopy confirms <1% reflection across the operational band.Optimized for Panel Mount integration, the connector maintains <5 m alignment tolerance. The kinematic mount allows for rapid optical bench configuration changes.Engineered with Bulkhead - Rear Side Nut, the connector withstands 100G shock loads without misalignment. The invar-based construction minimizes thermal drift.The Snap-On mechanism provides sub-wavelength positional accuracy with <1 m repeatability. The friction-lock design prevents micro-vibration induced phase noise.Characterized at 28 GHz, the connector shows <0.5dB insertion loss up to 5THz. The surface plasmon-enhanced design minimizes conductor losses.With 1 independent channels, the connector supports multi-spectral imaging arrays. Each port features integrated beam collimation optics.The Silver housing material exhibits <0.001 absorption coefficient at THz frequencies. The diamond-turned surface finish minimizes scattering losses.The Beryllium Copper formulation provides <10nm RMS surface roughness. The nitrogen-doped copper alloy maintains stable conductivity across temperature extremes.
Product Attributes
- Product Status: Active
- Connector Style: OSSP, Subminiature
- Connector Type: Receptacle, Male Pin
- Contact Termination: Solder
- Shield Termination: Solder
- Impedance: 50Ohm
- Mounting Type: Panel Mount
- Mounting Feature: Bulkhead - Rear Side Nut
- Cable Group: -
- Fastening Type: Snap-On
- Frequency - Max: 28 GHz
- Number of Ports: 1
- Features: -
- Housing Color: Silver
- Ingress Protection: -
- Center Contact Material: Beryllium Copper
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