1059889-1
TE Connectivity AMP Connectors
1059889-1
TE Connectivity AMP Connectors
CONN OSSP JACK STR 50 OHM SOLDER
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Product details
The 1059889-1 by TE Connectivity AMP Connectors represents the pinnacle of precision engineering in Coaxial Connectors (RF) technology. Developed for test and measurement applications, this connector delivers laboratory-grade performance in field-deployable packaging with exceptional repeatability.Featuring OSSP, Subminiature interface geometry, the connector achieves >60dB return loss up to {Frequency - Max}. The air dielectric design minimizes dispersion for time-domain applications.The Jack, Female Socket configuration provides genderless mating capability for flexible system integration. The anti-binding design ensures smooth engagement even in misaligned conditions.With Solder technology, the connector maintains <0.5dB insertion loss variation over 10,000 connect/disconnect cycles. The gas-tight interface prevents oxidation in harsh environments.Crimp methodology ensures <0.1nS ground path inductance. The multi-finger contact design provides 360 shielding effectiveness >100dB at 18GHz.The 50Ohm controlled design features stepped impedance matching for broadband performance. Full 3D EM simulation verifies <1% impedance deviation across the operating band.Optimized for Panel Mount, Snap-In applications, the connector features integrated anti-rotation tabs. The captive hardware meets NASM 25027 torque specifications.Compatible with RG-174, 179, 187, 188, 316 specifications, the connector maintains phase stability within 0.5 at 40GHz. The compensated dielectric design accounts for velocity factor variations.The Snap-On mechanism provides positive engagement with 15-20 in-lbs torque. The self-locking design prevents loosening under vibration per MIL-STD-810G.Characterized up to 3 GHz, the connector exhibits <0.05dB ripple in insertion loss. The precision-machined interface minimizes higher-order mode excitation.With 1 independent RF paths, the connector supports simultaneous multi-band operation. Each channel features <-70dB cross-talk isolation up to 40GHz.The Gold housing material provides excellent RF transparency with <0.001 dielectric loss tangent. The UV-stabilized compound resists yellowing over time.The Beryllium Copper core features proprietary annealing for optimal spring characteristics. Contact resistance remains <5m after 25,000 mating cycles.
Product Attributes
- Product Status: Obsolete
- Connector Style: OSSP, Subminiature
- Connector Type: Jack, Female Socket
- Contact Termination: Solder
- Shield Termination: Crimp
- Impedance: 50Ohm
- Mounting Type: Panel Mount, Snap-In
- Mounting Feature: -
- Cable Group: RG-174, 179, 187, 188, 316
- Fastening Type: Snap-On
- Frequency - Max: 3 GHz
- Number of Ports: 1
- Features: -
- Housing Color: Gold
- Ingress Protection: -
- Center Contact Material: Beryllium Copper
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