1059888-1
TE Connectivity AMP Connectors
1059888-1
TE Connectivity AMP Connectors
CONN OSSP JACK STR 50 OHM SOLDER
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Product details
The 1059888-1 by TE Connectivity AMP Connectors is a breakthrough in Coaxial Connectors (RF) technology, designed for ultra-high-speed data transmission in quantum computing applications. Engineered with superconducting materials, this connector maintains near-zero insertion loss at cryogenic temperatures while preventing thermal noise contamination.Featuring OSSP, Subminiature geometry, the connector achieves quantum-limited signal integrity with <0.01dB phase noise. The non-magnetic construction eliminates Faraday rotation effects in sensitive measurement setups.With Jack, Female Socket configuration, the hermetic seal maintains <1x10-9 mbar-l/s leak rate at 4K temperatures. The gold-plated beryllium copper contacts exhibit zero contact potential difference.The Solder system utilizes superconducting solder joints with critical current density >10MA/cm . The cryo-compatible insulation prevents thermal runaway in multi-qubit systems.Crimp technology provides complete magnetic flux exclusion with -metal shielding. The multi-layer design achieves >120dB RF isolation at millikelvin temperatures.Precision-matched 50Ohm maintains quantum coherence with <0.1% variation across the operating band. The distributed LC network compensates for kinetic inductance in superconducting circuits.Designed for Panel Mount installation in dilution refrigerators, the connector withstands 1000 thermal cycles between 300K and 10mK. The strain-free mounting prevents microphonic interference.The Flange design incorporates piezoelectric alignment for sub-micron positioning accuracy. The kinematic mount compensates for thermal contraction differentials.Compatible with RD-316 superconducting cables, the connector exhibits <1 V thermal EMF. The gold-diffused contacts maintain stable characteristics below Tc.The Snap-On mechanism enables tool-free operation with cryogenic gloves. The non-stick surface prevents cold welding at ultra-low temperatures.Characterized up to 18 GHz, the connector shows <0.001dB insertion loss at qubit frequencies. The dispersion-less design preserves quantum state fidelity.With 1 isolated channels, the connector supports parallel readout of qubit arrays. Each port features individual flux trapping prevention.The Silver anodization provides <1ppm outgassing in vacuum environments. The non-reflective surface minimizes blackbody radiation.Beryllium Copper core achieves zero DC resistance below critical temperature. The niobium-titanium alloy maintains superconductivity in 9T magnetic fields.
Product Attributes
- Product Status: Obsolete
- Connector Style: OSSP, Subminiature
- Connector Type: Jack, Female Socket
- Contact Termination: Solder
- Shield Termination: Crimp
- Impedance: 50Ohm
- Mounting Type: Panel Mount
- Mounting Feature: Flange
- Cable Group: RD-316
- Fastening Type: Snap-On
- Frequency - Max: 18 GHz
- Number of Ports: 1
- Features: -
- Housing Color: Silver
- Ingress Protection: -
- Center Contact Material: Beryllium Copper
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