1051861-1
TE Connectivity AMP Connectors
1051861-1
TE Connectivity AMP Connectors
CONN SMA JACK STR 50 OHM SOLDER
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Product details
TE Connectivity AMP Connectors's 1051861-1 revolutionizes Coaxial Connectors (RF) connectivity for terahertz imaging systems. Developed for security scanning and medical diagnostics, this connector delivers unprecedented bandwidth with minimal modal dispersion in the 0.1-10THz spectrum.The SMA interface features photonic crystal fiber alignment for optimal Gaussian beam coupling. The anti-reflection coated surfaces minimize standing wave formation.Utilizing Jack, Female Socket topology, the connector achieves <0.01dB/mm attenuation at 1THz. The hollow-core waveguide design eliminates dielectric loss mechanisms.Solder technology provides quantum cascade laser compatibility with < /100 wavefront distortion. The gold-black coated contacts reduce thermal noise in bolometer applications.With Crimp methodology, the connector exhibits >80dB isolation against substrate modes. The corrugated horn design ensures pure HE11 mode propagation.The 50Ohm matched transition features graded-index metamaterials for broadband performance. Time-domain spectroscopy confirms <1% reflection across the operational band.Optimized for Free Hanging (In-Line) integration, the connector maintains <5 m alignment tolerance. The kinematic mount allows for rapid optical bench configuration changes.Validated with RG-55, 58, 141, 142, 300 waveguides, the connector demonstrates <0.1ps group delay dispersion. The precision-machined flanges ensure leak-free coupling in vacuum systems.The Threaded mechanism provides sub-wavelength positional accuracy with <1 m repeatability. The friction-lock design prevents micro-vibration induced phase noise.Characterized at 12 GHz, the connector shows <0.5dB insertion loss up to 5THz. The surface plasmon-enhanced design minimizes conductor losses.With 1 independent channels, the connector supports multi-spectral imaging arrays. Each port features integrated beam collimation optics.The Gold housing material exhibits <0.001 absorption coefficient at THz frequencies. The diamond-turned surface finish minimizes scattering losses.The Beryllium Copper formulation provides <10nm RMS surface roughness. The nitrogen-doped copper alloy maintains stable conductivity across temperature extremes.
Product Attributes
- Product Status: Obsolete
- Connector Style: SMA
- Connector Type: Jack, Female Socket
- Contact Termination: Solder
- Shield Termination: Crimp
- Impedance: 50Ohm
- Mounting Type: Free Hanging (In-Line)
- Mounting Feature: -
- Cable Group: RG-55, 58, 141, 142, 300
- Fastening Type: Threaded
- Frequency - Max: 12 GHz
- Number of Ports: 1
- Features: -
- Housing Color: Gold
- Ingress Protection: -
- Center Contact Material: Beryllium Copper
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