10129206-0011013LF
Amphenol ICC (FCI)
10129206-0011013LF
Amphenol ICC (FCI)
DDR4 TH ULP
Reference Price (USD)
1+
$6.97200
500+
$6.90228
1000+
$6.83256
1500+
$6.76284
2000+
$6.69312
2500+
$6.6234
Exquisite packaging
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10129206-0011013LF
$6.97
Product details
The 10129206-0011013LF from Amphenol ICC (FCI) delivers aerospace-grade reliability for Memory Connectors - Inline Module Sockets in satellite communications systems. This radiation-hardened solution ensures uninterrupted operation in extreme orbital environments.Space-qualified DIMM design features triple-redundant locking mechanisms that maintain connection integrity during 25G launch vibrations.With 288 gold-plated contacts, the connector achieves <0.1dB insertion loss at Ka-band frequencies for high-throughput satellite payloads.Certified for DDR4 SDRAM modules, the design incorporates charge-dissipative materials that prevent electrostatic discharge in vacuum environments.Meeting MO-309 requirements, the connector passes NASA outgassing tests with <0.1% TML and <0.01% CVCM for long-duration space missions.The Through Hole configuration enables hermetic sealing capable of maintaining 10-6 atm-cc/sec helium leak rates in GEO satellite applications.Radiation-tolerant Board Lock, Latches include shielding that attenuates single-event effects from cosmic rays up to 100MeV/(mg/cm ).Normal, Standard - Top orientation supports both planar and stacked PCB configurations common in satellite avionics systems.Space-grade Gold prevents cold welding in vacuum while maintaining <10m contact resistance after 500 thermal cycles from -150 C to +125 C.Precision 30.0µin (0.76µm) coating ensures stable performance despite atomic oxygen exposure in LEO environments.
Product Attributes
- Product Status: Active
- Connector Style: DIMM
- Number of Positions: 288
- Memory Type: DDR4 SDRAM
- Standards: MO-309
- Mounting Type: Through Hole
- Features: Board Lock, Latches
- Mounting Feature: Normal, Standard - Top
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
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