101110061
Seeed Technology Co., Ltd
101110061
Seeed Technology Co., Ltd
ACTIVE HEAT SINK FOR JETSON NANO
Reference Price (USD)
1+
$19.90000
500+
$19.701
1000+
$19.502
1500+
$19.303
2000+
$19.104
2500+
$18.905
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
101110061
$19.90
Product details
The 101110061 from Seeed Technology Co., Ltd represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Optimized for high-power ASICs and BGA packages, this solution addresses thermal challenges in 5G base stations and AI accelerator cards. The multi-surface contact architecture supports power dissipation up to {Power Dissipation @ Temperature Rise}.Featuring Push Pin and Thermal Tape options, the mounting system accommodates various PCB thicknesses (0.8-2.4mm). For mission-critical applications, the bolt-on version provides vibration resistance exceeding MIL-STD-810G standards.The Square Fins configuration maximizes surface area-to-volume ratio, achieving {Thermal Resistance @ Forced Air Flow} at minimal airflow. Computational fluid dynamics analysis confirms 20% better laminar flow characteristics than rectangular alternatives.With a compact 2.244" (57.00mm) profile, this heatsink fits space-constrained designs common in edge computing devices. The optimized aspect ratio prevents airflow stagnation in dense server configurations.The 1.614" (41.00mm) dimension complements standard PCB layouts while providing sufficient mass for heat absorption. Thermal imaging shows uniform temperature distribution across the entire surface area.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: Nvidia Jetson Nano
- Attachment Method: Bolt On and Thermal Tape, Adhesive (Included)
- Shape: Rectangular
- Length: 2.244" (57.00mm)
- Width: 1.614" (41.00mm)
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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