10053868-E1502LF

Optimized for industrial automation systems, the 10053868-E1502LF by Amphenol ICC (FCI) redefines reliability standards in Memory Connectors - PC Card Sockets. This robust connector solution incorporates advanced materials and precision engineering to withstand the rigors of Industry 4.0 environments.Supporting CompactFlash® - Type II interfaces, the connector enables flexible fieldbus connectivity options. Its modular design allows for hot-swapping of communication modules without system downtime.The 50 configuration has been specifically designed for industrial I/O applications. The contact arrangement supports both signal and power transmission in a single compact package.The Connector system features a positive locking mechanism that withstands 100N of pull force. This exceeds typical industrial requirements for vibration resistance in robotic applications.With Push In, Pull Out operation, the connector enables tool-free maintenance in confined spaces. The color-coded mating indicators prevent incorrect module installation.The Surface Mount, Right Angle version includes integrated strain relief for cable harnesses. This feature is particularly valuable in applications subject to constant mechanical stress.The Board Guide, Card Guide include built-in ESD protection up to 15kV, safeguarding sensitive industrial electronics. This exceeds IEC 61000-4-2 Level 4 requirements for electrostatic discharge immunity.The 0.250" (6.35mm) low-profile design facilitates installation in control cabinets with limited clearance. Despite its compact size, the connector maintains full finger-safe protection.Available in Reverse - Bottom configurations, the connector supports both DIN rail and direct PCB mounting. This flexibility simplifies panel builder workflows.The Gold plating has been tested for 500+ mating cycles with minimal wear. This durability is critical for frequently changed modules in flexible manufacturing systems.With 30.0µin (0.76µm) gold plating, the contacts maintain stable resistance in humid environments. The plating thickness has been optimized for both performance and cost in industrial volumes.