10033854-052ASLF

The 10033854-052ASLF by Amphenol ICC (FCI) revolutionizes Memory Connectors - Inline Module Sockets technology for IoT edge devices, combining ultra-low power consumption with robust RF performance. This innovative connector enables seamless memory integration in space-constrained smart sensor applications.Featuring SODIMM geometry, the design minimizes parasitic capacitance to 0.8pF max, crucial for energy-harvesting devices operating at sub-1V voltages.With 200 high-efficiency contacts, the connector achieves 92% power transfer efficiency while maintaining 40Gbps signal integrity for edge AI processing.Optimized for DDR2 SDRAM modules, the contact system employs nano-coated springs that reduce insertion force by 35% without compromising vibration resistance.Compliant with MO-274 specifications, the connector meets EN 61000-4-3 radiated immunity requirements for industrial IoT deployments in RF-heavy environments.The Surface Mount, 30° Angle implementation supports reflow soldering processes with 260 C peak temperature tolerance, ideal for mass production of wearable electronics.Integrated Board Guide, Latches include magnetic latching that ensures reliable connections in moving assemblies while enabling tool-less module replacement.Reverse configuration allows vertical or horizontal PCB mounting with identical signal integrity performance for flexible industrial design.The advanced Gold formulation prevents oxidation in humid environments while maintaining <3m contact resistance after 10,000 mating cycles.Precision-controlled 30.0µin (0.76µm) deposition ensures consistent performance across -40 C to +85 C operating range for outdoor IoT nodes.