10033853-252TSLF

Amphenol ICC (FCI)'s 10033853-252TSLF represents the next evolution in Memory Connectors - Inline Module Sockets technology, optimized for industrial automation systems demanding ruggedized memory solutions. The 10033853-252TSLF combines military-grade durability with cutting-edge signal integrity features.Utilizing SODIMM architecture, the connector achieves 360 shielding effectiveness for operation in electrically noisy factory environments with >60dB EMI suppression.The 200 configuration supports parallel memory bus architectures while maintaining crosstalk below -40dB at 5GHz frequencies for PLC applications.Specially engineered for DDR2 SDRAM compatibility, the contact system features dual-beam design that compensates for PCB warpage up to 0.15mm in harsh industrial conditions.Meeting MO-274 requirements, the connector undergoes 100% automated optical inspection to ensure sub-micron alignment accuracy for Industry 4.0 equipment.Designed for Surface Mount, 30° Angle implementation, the package withstands 50G mechanical shock and 10G vibration profiles per IEC 60068-2 standards.The integrated Board Guide, Latches system enables tool-less module installation while providing IP67-rated dust/fluid protection for food processing machinery applications.Normal, Standard - Top configuration allows direct integration with backplane designs, reducing signal path length by 30% compared to conventional right-angle solutions.Gold surface treatment achieves >1000N/mm contact normal force, preventing micro-arcing in high-altitude industrial environments.With 11.8µin (0.30µm) deposition, the contacts maintain <2m resistance drift after 2000 thermal cycles from -40 C to +105 C.