100-1221-3
BECOM Systems GmbH
100-1221-3
BECOM Systems GmbH
IC MOD CM-BF537 600MHZ 32MB
Reference Price (USD)
1+
$364.50000
500+
$360.855
1000+
$357.21
1500+
$353.565
2000+
$349.92
2500+
$346.275
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Product details
Engineered for next-generation automotive electronics, the 100-1221-3 by BECOM Systems GmbH redefines performance in the Embedded - Microcontroller, Microprocessor, FPGA Modules category. Its combination of functional safety features and high-speed processing makes it ideal for ADAS and autonomous vehicle perception systems.The MPU Core architecture provides automotive-grade reliability with its dual-core lockstep configuration. This fail-operational design exceeds ISO 26262 ASIL-D requirements for safety-critical vehicle systems.The CM-BF537 delivers automotive-qualified performance with its temperature-compensated clock generation. Its superscalar architecture efficiently processes multiple sensor fusion algorithms simultaneously for comprehensive environment modeling.Operating at 600MHz, the processor meets the real-time requirements of vehicle bus networks. The clock distribution network features automotive-grade jitter attenuation for reliable CAN FD and Automotive Ethernet communication.The 4MB flash memory supports over-the-air update capabilities with robust rollback protection. This secure storage solution is essential for complying with automotive cybersecurity standards like WP.29.32MB of error-correcting RAM ensures fault-tolerant operation of safety monitors. The memory subsystem's parity checking provides additional protection against single-event upsets in radiation-prone environments.The automotive-grade Expansion 2 x 60 interface meets USCAR vibration specifications. Its sealed design prevents moisture ingress in under-hood applications while maintaining signal integrity at high speeds.With dimensions of 1.44" x 1.24" (36.5mm x 31.5mm), the module fits within stringent automotive form factor requirements. The package's thermal design maintains performance during extended high-temperature operation in engine compartments.Qualified for 0°C ~ 70°C, the solution withstands the thermal extremes of electric vehicle power electronics. Extensive reliability testing ensures operation throughout the vehicle's lifespan.
Product Attributes
- Product Status: Active
- Module/Board Type: MPU Core
- Core Processor: CM-BF537
- Co-Processor: -
- Speed: 600MHz
- Flash Size: 4MB
- RAM Size: 32MB
- Connector Type: Expansion 2 x 60
- Size / Dimension: 1.44" x 1.24" (36.5mm x 31.5mm)
- Operating Temperature: 0°C ~ 70°C