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100-008-001

3M
100-008-001 Preview
100-008-001
3M
CONN IC DIP SOCKET 8POS GOLD
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100-008-001

100-008-001

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Product details

Product Attributes

  • Product Status: Obsolete
  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 8 (2 x 4)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 8.00µin (0.203µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame, Seal Tape
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Brass
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -65°C ~ 125°C

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