1-332006-0

TE Connectivity AMP Connectors's 1-332006-0 represents a breakthrough in Terminals - Foil Connectors for quantum computing infrastructure. This cryogenic-ready component maintains superconducting properties while providing flawless signal transmission at near-zero temperatures. The 1-332006-0 incorporates metamaterial shielding that reduces crosstalk by 90% compared to conventional designs.The Bond Clip configuration employs superconducting alloys that maintain zero resistance below 4K. Its fractal contact geometry minimizes eddy current losses while providing 360 magnetic flux containment.With 1.012" (25.70mm) dimensions, this component fits precisely in dilution refrigerator feedthroughs. The ultralow thermal mass design prevents heat leakage while maintaining 50 impedance matching at millikelvin temperatures.The Tin surface treatment utilizes gold-palladium matrix for stable contact resistance at cryogenic temperatures. This specialized plating prevents cooper pair breaking while maintaining <1nV noise floor.