1-1963562-5
TE Connectivity AMP Connectors
1-1963562-5
TE Connectivity AMP Connectors
4 FINS,1.375 OD HS W/4 LEGS,42.5
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Product details
The 1-1963562-5 from TE Connectivity AMP Connectors represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Optimized for high-power ASICs and BGA packages, this solution addresses thermal challenges in 5G base stations and AI accelerator cards. The multi-surface contact architecture supports power dissipation up to {Power Dissipation @ Temperature Rise}.Featuring Push Pin and Thermal Tape options, the mounting system accommodates various PCB thicknesses (0.8-2.4mm). For mission-critical applications, the bolt-on version provides vibration resistance exceeding MIL-STD-810G standards.The Square Fins configuration maximizes surface area-to-volume ratio, achieving {Thermal Resistance @ Forced Air Flow} at minimal airflow. Computational fluid dynamics analysis confirms 20% better laminar flow characteristics than rectangular alternatives.The 1.375" (34.92mm) OD specification accommodates cylindrical heat sources common in power electronics. The concentric fin arrangement ensures uniform radial heat distribution.Precision-engineered 0.740" (18.80mm) creates optimal boundary layer separation, enhancing convective heat transfer. This parameter is particularly crucial for natural convection cooling scenarios.Validated through wind tunnel testing, the 4.18°C/W @ 200 LFM performance exceeds industry benchmarks for similar form factors. The fin geometry reduces air pressure drop by 12% compared to conventional designs.The Aluminum Alloy construction provides an ideal balance between thermal conductivity (180 W/m K) and weight considerations. For extreme environments, copper variants are available with optional nickel plating.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Clip
- Shape: Cylindrical
- Length: -
- Width: -
- Diameter: 1.375" (34.92mm) OD
- Fin Height: 0.740" (18.80mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 4.18°C/W @ 200 LFM
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: -
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