1-1963558-3
TE Connectivity AMP Connectors
1-1963558-3
TE Connectivity AMP Connectors
3 FINS,1.375 OD HS W/4 LEGS,35MM
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Product details
The 1-1963558-3 from TE Connectivity AMP Connectors delivers precision thermal management for medical devices in the Thermal - Heat Sinks category. Designed for reliability in life-critical applications, this solution combines biocompatible materials with exceptional thermal performance for imaging and diagnostic equipment.The Board Level Extrusion design provides EMI shielding compatibility crucial for sensitive medical electronics. The integrated grounding features reduce RF interference by 25dB compared to standard designs.Specialized for CPU and ASIC cooling in medical imaging systems, the solution handles {Power Dissipation @ Temperature Rise} with minimal acoustic signature. The thermal interface maintains stability through repeated sterilization cycles.Medical-grade Thermal Tape allows non-conductive attachment meeting IEC 60601-1 leakage current requirements. The adhesive maintains bond strength after 100+ autoclave cycles at 134 C.Rectangular Fins configuration achieves {Thermal Resistance @ Forced Air Flow} in laminar airflow environments. The streamlined design prevents particulate accumulation per ISO 14644 Class 5 cleanroom standards.For cylindrical sensor housings, the 1.375" (34.92mm) OD variant provides uniform cooling without compromising sterilization access. The design allows for steam penetration during autoclaving.Precision 0.540" (13.72mm) ensures compatibility with medical device airflow restrictions (typically <0.5m/s). The fin density is optimized for silent operation (<20dB) in patient care environments.The 5.45°C/W @ 200 LFM performance is validated under the intermittent operation profiles typical of medical equipment. The design maintains stable performance during 10% duty cycle bursts.Medical-grade Aluminum (EN AW-1350) with 99.5% purity ensures biocompatibility. The material is certified per ISO 10993-5 for cytotoxicity and ISO 10993-10 for irritation sensitivity.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Clip
- Shape: Cylindrical
- Length: -
- Width: -
- Diameter: 1.375" (34.92mm) OD
- Fin Height: 0.540" (13.72mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 5.45°C/W @ 200 LFM
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: -
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