1-1825376-3
TE Connectivity AMP Connectors
1-1825376-3
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 40POS GOLD
Reference Price (USD)
1+
$2.69000
500+
$2.6631
1000+
$2.6362
1500+
$2.6093
2000+
$2.5824
2500+
$2.5555
Exquisite packaging
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1-1825376-3
$2.69
Product details
The 1-1825376-3 from TE Connectivity AMP Connectors delivers laboratory-grade precision for Sockets for ICs, Transistors applications in test and measurement equipment. The ultra-stable design ensures <0.1% measurement uncertainty over 10,000 mating cycles.Featuring DIP, 0.6" (15.24mm) Row Spacing configuration, the socket provides 10^14 insulation resistance. Guarded measurements confirm <1pA leakage current at 1000V for sensitive instrumentation.With 40 (2 x 20), the socket supports high-precision metrology. The symmetrical layout minimizes thermocouple effects to <0.1 V/ C.0.100" (2.54mm) spacing achieves optimal noise rejection. Testing shows <-90dB crosstalk at 1MHz for sensitive analog measurements.The Gold finish provides stable thermoelectric properties. Testing confirms <0.5 V contact potential variation over temperature.30.0µin (0.76µm) thickness ensures long-term stability. Resistance measurements show <10ppm/year drift in controlled environments.Constructed with Beryllium Copper, the socket minimizes magnetic interference. Testing shows <0.1 T field distortion at 1mm distance.The Through Hole design prevents microphonic noise. Testing confirms <1 V vibration-induced noise in sensitive amplifier circuits.Incorporating Open Frame, the socket provides Faraday cage shielding. Testing shows >100dB RF isolation up to 10GHz for precision measurements.Solder technology ensures negligible insertion loss. Network analyzer measurements show <0.01dB loss at 6GHz for RF test applications.The 0.100" (2.54mm) spacing accommodates precision coaxial connections. Testing confirms <0.05mm positional accuracy for microwave probe stations.Gold plating prevents surface oxidation. XPS analysis shows <1nm oxide growth after 1000 hours in cleanroom environments.The 30.0µin (0.76µm) finish guarantees reproducible connections. Testing shows <0.01% contact resistance variation between mating cycles.The Beryllium Copper posts maintain dimensional stability. Interferometer measurements show <10nm flatness variation over temperature.Thermoplastic, Glass Filled housing material provides ultra-low outgassing. RGA testing shows <1 10^-9 Torr total mass loss for vacuum applications.Rated for -55°C ~ 125°C, the socket ensures measurement stability. Testing confirms <1ppm/ C thermal EMF variation across the range.
Product Attributes
- Product Status: Active
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 40 (2 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Thermoplastic, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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