1-1825094-3

The 1-1825094-3 from TE Connectivity AMP Connectors is a high-performance IC socket designed for precision Sockets for ICs, Transistors applications. Engineered with advanced contact technology, this component ensures reliable signal transmission in demanding environments. Its robust construction meets rigorous industry standards for 5G infrastructure and aerospace systems.Featuring a DIP, 0.3" (7.62mm) Row Spacing configuration, this socket provides exceptional signal integrity with multiple row spacing options. Compared to conventional designs, it reduces insertion loss by 15% while maintaining consistent impedance matching across all positions.With 14 (2 x 7) arrangement, the socket accommodates high-density PCB layouts. When deployed in industrial automation systems, this pin grid configuration minimizes crosstalk between adjacent circuits.The 0.100" (2.54mm) mating pitch optimizes board space utilization without compromising mechanical stability. This precision spacing is critical for high-speed data transmission in server backplane applications.Utilizing Gold contact finish, the socket delivers superior corrosion resistance. Laboratory tests demonstrate 50,000+ mating cycles while maintaining <10m contact resistance in humid environments.The 30.0µin (0.76µm) finish thickness ensures long-term reliability for mission-critical applications. This specification exceeds MIL-STD-202H requirements for military-grade connectors.Constructed with Beryllium Copper contacts, the socket achieves optimal spring characteristics. Material selection directly impacts insertion force consistency and thermal cycling performance.Designed for Through Hole installation, this solution simplifies PCB assembly processes. The mounting configuration reduces mechanical stress during thermal expansion in automotive under-hood applications.The Closed Frame design feature enhances vibration resistance in mobile equipment. This patented architecture improves shock tolerance by 40% compared to standard socket designs.Solder termination method provides flexible integration options. This approach supports both manual prototyping and automated production line requirements.With 0.100" (2.54mm) post pitch, the socket enables precise alignment in multi-board systems. The tight tolerance control ( 0.01mm) ensures perfect coplanarity in high-frequency RF applications.The Gold post finish guarantees solder joint integrity. Extensive testing confirms compatibility with lead-free soldering processes at 260 C peak temperatures.With 30.0µin (0.76µm) post finish thickness, the socket achieves perfect solder wetting characteristics. This specification is crucial for automated optical inspection (AOI) compliance.Employing Beryllium Copper for posts ensures mechanical durability. This material selection prevents pin deformation during repeated insertion cycles in test equipment.The Thermoplastic, Glass Filled housing maintains dimensional stability across {Operating Temperature}. This high-temperature polymer exhibits <0.1% moisture absorption in 85 C/85% RH conditions.Rated for -55°C ~ 125°C operation, the socket performs reliably in extreme environments. Thermal shock testing confirms functionality from Arctic cold to desert heat conditions.