094-6136-0000

TE Connectivity Aerospace, Defense and Marine

General info

Part Number

094-6136-0000

Manufacturer

TE Connectivity Aerospace, Defense and Marine

Description:

CONN MICRO-D RCPT 9POS SLDR CUP

Reference Price (USD)

$53.44000

500+

$52.9056

1000+

$52.3712

1500+

$51.8368

2000+

$51.3024

2500+

$50.768

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

094-6136-0000

$53.44

Product details

TE Connectivity Aerospace, Defense and Marine's 094-6136-0000 redefines performance standards in D-Sub Connectors for next-generation industrial automation systems. The patented contact geometry achieves 12G shock resistance while maintaining <1ns signal skew across all channels.The D-Type, Micro-D design incorporates polarized mating guides that prevent misinsertion damage in blind-mate rack installations.Utilizing Receptacle, Female Sockets configuration, the contacts feature hyperbolic geometry that reduces mating force by 25% while increasing wipe distance to 2.5mm.9 hybrid layout separates power and signal contacts with integrated ferrite beads for conducted EMI suppression up to 30dB.Precision-stamped 2 contact arrays maintain 0.05mm positional accuracy for high-speed differential pair alignment.The Free Hanging (In-Line) version includes integrated strain relief that withstands 50N cable pull force without deformation.The Signal implementation uses oxygen-free copper with grain-stabilized annealing for stable resistance over 10,000 mating cycles.Housing/Shell (Unthreaded) design features captive stainless steel hardware that prevents loosening under 5G vibration per MIL-STD-202G.Our Solder Cup process creates cold-welded joints with fracture strength exceeding conductor tensile values by 20%.The Metal, Yellow Chromate Plated Cadmium combination demonstrates >500-hour humidity resistance per MIL-STD-810 Method 507.6.Gold surface treatment maintains <15m contact resistance after 100 hours mixed flowing gas testing.The 50.0µin (1.27µm) specification ensures proper noble metal diffusion barrier formation during high-temperature aging tests.The Reverse Layout package includes integrated ESD protection diodes rated for 15kV air discharge per IEC 61000-4-2.