0933-1-15-20-75-14-11-0
Mill-Max Manufacturing Corp.
Product details
The 0933-1-15-20-75-14-11-0 by Mill-Max Manufacturing Corp. redefines Contacts, Spring Loaded (Pogo Pins), and Pressure performance in high-speed computing applications, featuring {Mating Cycles} mating cycles with exceptional signal integrity. Engineered with {Contact Finish} plating at {Contact Finish Thickness}, these contacts deliver superior EMI shielding for server backplanes and data center equipment.Utilizing Sleeve & Plunger (Pogo Pins) technology, these contacts maintain impedance control for high-speed differential pairs up to 56Gbps.The Through Hole, Solder Cup configuration enables high-density PCB layouts required in next-generation computing hardware.0.226" (5.74mm) maximum working height accommodates complex heat sink assemblies in server architectures.For optimal signal reflection characteristics, implement 0.198" (5.04mm) as the working height.The 0.171" (4.34mm) minimum working height supports ultra-thin blade server designs.High-speed optimized Circular - 0.078" (1.98mm) (TH) pad geometry minimizes parasitic capacitance in DDR5 memory interfaces.10gf initial contact force prevents signal bounce during hot-swap operations.Precisely calibrated 60gf mid-compression force maintains connection stability during thermal cycling.The 0.042" (1.07mm) Dia plunger diameter is optimized for both high-frequency performance and mechanical endurance.Computing-grade 24 AWG include crosstalk reduction technology for high-speed bus applications.Advanced Beryllium Copper alloy provides the ideal combination of conductivity and thermal management.
Product Attributes
- Product Status: Active
- Contact Type: Sleeve & Plunger (Pogo Pins)
- Mounting Type: Through Hole, Solder Cup
- Maximum Working Height: 0.226" (5.74mm)
- Recommended Working Height: 0.198" (5.04mm)
- Minimum Working Height: 0.171" (4.34mm)
- Pad Layout Dimension: Circular - 0.078" (1.98mm) (TH)
- Operating Force - Initial: 10gf
- Operating Force - Mid Compression: 60gf
- Plunger Size: 0.042" (1.07mm) Dia
- Features: 24 AWG
- Mating Cycles: 1000000
- Contact Material: Beryllium Copper
- Contact Finish: Gold
- Contact Finish Thickness: 20.0µin (0.51µm)