0877823003
Molex
Product details
The 0877823003 from Molex delivers military-spec performance in Memory Connectors - Inline Module Sockets for aerospace and defense applications. This ruggedized connector meets the most demanding environmental and reliability requirements.Military-spec MiniDIMM implementation features hermetic sealing that passes MIL-STD-810H salt fog testing for naval electronics applications.With 244 mil-spec contacts, the design maintains signal integrity despite 50kV/m EMP exposure per MIL-STD-461G requirements.Certified for DDR3 SDRAM modules in avionics systems, the connector incorporates radiation-hardened materials that withstand 100kRad TID.Exceeding MO-244 requirements, the design passes MIL-STD-202G mechanical shock testing at 100G for missile guidance systems.The Surface Mount configuration enables conformal coating compatibility while maintaining >1012 insulation resistance in humid environments.Battlefield-ready Board Guide, Cover, Latches include EMI gaskets that achieve 80dB shielding from 10MHz to 40GHz for electronic warfare applications.Normal, Standard - Top orientation supports both conventional and orthogonal PCB layouts in space-constrained military enclosures.Specialized Gold prevents dendritic growth in high-humidity conditions while maintaining <10m contact resistance after 500 mating cycles.Precision 30.0µin (0.76µm) deposition ensures reliable operation across -55 C to +200 C temperature ranges in jet engine monitoring systems.
Product Attributes
- Product Status: Active
- Connector Style: MiniDIMM
- Number of Positions: 244
- Memory Type: DDR3 SDRAM
- Standards: MO-244
- Mounting Type: Surface Mount
- Features: Board Guide, Cover, Latches
- Mounting Feature: Normal, Standard - Top
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)