08-823-90T
Aries Electronics
08-823-90T
Aries Electronics
CONN IC DIP SOCKET 8POS TIN
Reference Price (USD)
1+
$3.91069
500+
$3.8715831
1000+
$3.8324762
1500+
$3.7933693
2000+
$3.7542624
2500+
$3.7151555
Exquisite packaging
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08-823-90T
$3.91
Product details
Designed for mission-critical systems, 08-823-90T by Aries Electronics sets new standards in Sockets for ICs, Transistors technology. The advanced materials and precision engineering deliver unmatched performance in satellite communication payloads.The DIP, 0.3" (7.62mm) Row Spacing configuration supports multi-GHz signal transmission. Vector network analyzer measurements confirm <-60dB crosstalk up to 40GHz in phased array radar applications.The 8 (2 x 4) layout enables efficient heat dissipation. Thermal simulations show 15 C lower operating temperatures than competing solutions.0.100" (2.54mm) spacing achieves optimal impedance control. Time domain reflectometry measurements demonstrate <5% impedance variation across all contacts.Featuring Tin finish, the socket maintains stable contact resistance. Testing under 95% RH conditions shows <2m variation over 1,000 hours.The 200.0µin (5.08µm) coating provides exceptional durability. Wear testing indicates <0.5 m material loss after 25,000 insertion cycles.Phosphor Bronze contacts ensure reliable operation in vacuum environments. The material outgassing rate meets NASA ASTM E595 requirements.The Through Hole, Right Angle, Horizontal design simplifies maintenance in railway signaling systems. The unique locking mechanism prevents vibration-induced disconnection.With Closed Frame, the socket achieves EMI shielding effectiveness >60dB. This meets MIL-STD-461G requirements for sensitive military electronics.Solder method enables high-speed signal integrity. Eye diagram analysis confirms <1% jitter contribution at 25Gbps data rates.The 0.100" (2.54mm) post spacing accommodates high-voltage applications. Dielectric testing confirms 2.5kV isolation between adjacent posts.Tin plating prevents whisker growth in humid environments. This addresses JEDEC JESD22-A121 compliance requirements.The 200.0µin (5.08µm) finish ensures perfect solder joints. Cross-section analysis reveals 100% intermetallic coverage in reflow processes.The Phosphor Bronze posts withstand repeated thermal cycling. Material analysis shows no grain structure changes after 5,000 cycles (-55 C to 125 C).Polyamide (PA46), Nylon 4/6 housing material offers exceptional chemical resistance. The material withstands immersion in hydraulic fluids and jet fuels.
Product Attributes
- Product Status: Active
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Mounting Type: Through Hole, Right Angle, Horizontal
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
- Housing Material: Polyamide (PA46), Nylon 4/6
- Operating Temperature: -
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