0762910068

Molex

General info

Part Number

0762910068

Manufacturer

Molex

Description:

CONN EDGE DUAL FMALE 68POS 0.030

Reference Price (USD)

$35.02000

500+

$34.6698

1000+

$34.3196

1500+

$33.9694

2000+

$33.6192

2500+

$33.269

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

0762910068

$35.02

Product details

Molex's 0762910068 delivers cutting-edge performance in Card Edge Connectors - Edgeboard Connectors for 5G infrastructure. Precision-engineered for RF signal integrity, this connector minimizes insertion loss while maximizing power handling capacity.The Non Specified - Dual Edge compatible design features impedance-matched transitions. The graduated dielectric constant maintains <1.2 VSWR up to 40GHz.The Female configuration includes RF shielding continuity. Multi-finger gaskets provide 360 shielding with <2m contact resistance at grounding points.With 34 contacts per bay, the layout optimizes RF performance. Ground-signal-ground arrangement minimizes crosstalk between adjacent channels.The 68 contact configuration supports massive MIMO arrays. Each contact path is individually tuned to maintain phase coherence across all channels.Compatible with 0.057" ~ 0.069" (1.44mm ~ 1.76mm) cards, the connector features constant-impedance transitions. The tapered contact design prevents impedance discontinuities at card entry points.The 2 row arrangement incorporates resonant suppression. Quarter-wave stubs integrated into the housing prevent cavity resonances in 24-30GHz bands.The 0.030" (0.76mm) pitch design enables millimeter-wave operation. Electromagnetic simulations verify <-30dB coupling between adjacent contacts at 60GHz.Dual readout capability supports beamforming calibration. Integrated test ports allow vector network analyzer measurements without disassembly.The Board Guide package includes integrated RFI filters. These -network filters provide 40dB rejection of out-of-band signals from 1MHz to 6GHz.The Through Hole, Right Angle version includes thermal management features. The aluminum housing provides 5 C/W thermal resistance for power amplifier cooling.Press-Fit process maintains RF performance. The solder joint geometry is optimized to minimize parasitic inductance (<0.5nH per contact).The Copper Alloy contacts exhibit excellent high-frequency characteristics. Skin effect resistance is 30% lower than standard alloys at 28GHz.Gold plating provides stable RF performance. Surface roughness is controlled to <0.2 m RMS to minimize conductor loss at microwave frequencies.With 29.5µin (0.75µm) gold plating, the contacts achieve <0.1dB insertion loss per contact at 40GHz. This specification meets 5G fronthaul requirements.The Black housing incorporates RF-absorbent material. This carbon-loaded polymer reduces surface wave propagation by 15dB at 60GHz.Rated for -40°C ~ 105°C, the connector uses low-dK materials. The dielectric constant varies less than 2% across the temperature range.