0732540430
Molex
0732540430
Molex
SMP JACK PCB TH 50 OHM
Reference Price (USD)
1+
$8.80545
500+
$8.7173955
1000+
$8.629341
1500+
$8.5412865
2000+
$8.453232
2500+
$8.3651775
Exquisite packaging
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0732540430
$8.81
Product details
Optimized for next-generation networks, Molex's 0732540430 delivers breakthrough performance in Coaxial Connectors (RF) applications. This innovative solution combines millimeter-wave readiness with robust mechanical design for 5G infrastructure deployment.The QMA interface features patented dielectric loading for enhanced mode suppression. Comparative testing shows 30% better TE11 mode rejection than conventional designs.With Jack, Female Socket configuration, the connector achieves VSWR <1.15:1 up to {Frequency - Max}. The elliptical interface design minimizes higher-order mode generation.Solder technology provides cold weld equivalent performance without special tools. The diffusion-barrier plating ensures stable contact resistance over 10,000 cycles.The Solder system delivers <0.5 ground path resistance up to 40GHz. The multi-point contact design eliminates ground loops in phased array systems.Precision 50Ohm control is maintained through compensated dielectric geometry. Full-wave simulation confirms <2% impedance variation across the operating band.Designed for Panel Mount installation, the connector features integrated torque indication for proper mating force. The anti-rotation design prevents cable twisting during operation.Flange design enables tool-less panel installation in <15 seconds. The floating contact design compensates for 0.5mm panel misalignment.The Snap-On mechanism provides positive engagement with <180 rotation. The self-cleaning contacts remove oxide buildup during mating cycles.Characterized at 18 GHz, the connector exhibits insertion loss <0.1dB/inch at 30GHz. The low-loss dielectric material minimizes group delay distortion.With 1 individually shielded channels, the connector supports massive MIMO configurations. Each port features integrated ESD protection to 15kV.Advanced Extended Insulation include integrated passive intermodulation (PIM) traps for <-160dBc performance. The connector is qualified per MIL-PRF-39012 for defense applications.The Gold housing incorporates conductive additives for enhanced EMI shielding. Material properties are verified per UL 94V-0 flammability standards.The Beryllium Copper formulation provides excellent stress relaxation resistance. Contact force remains >100g after 50,000 mating cycles per EIA-364-09.
Product Attributes
- Product Status: Active
- Connector Style: QMA
- Connector Type: Jack, Female Socket
- Contact Termination: Solder
- Shield Termination: Solder
- Impedance: 50Ohm
- Mounting Type: Panel Mount
- Mounting Feature: Flange
- Cable Group: -
- Fastening Type: Snap-On
- Frequency - Max: 18 GHz
- Number of Ports: 1
- Features: Extended Insulation
- Housing Color: Gold
- Ingress Protection: -
- Center Contact Material: Beryllium Copper
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