0527933070
Molex
0527933070
Molex
CONN FPC TOP 30POS 1.00MM R/A
Reference Price (USD)
1+
$1.93000
500+
$1.9107
1000+
$1.8914
1500+
$1.8721
2000+
$1.8528
2500+
$1.8335
Exquisite packaging
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0527933070
$1.93
Product details
Molex's 0527933070 sets new benchmarks in FFC, FPC (Flat Flexible) Connectors technology, optimized for mission-critical signal transmission. This high-reliability connector combines advanced materials science with precision engineering to deliver unmatched performance in 5G infrastructure applications.Designed specifically for FPC implementations, this connector features impedance-matched signal paths. The embedded shielding technology reduces EMI by 15dB compared to standard designs.The Surface Mount, Right Angle configuration enables high-speed pick-and-place assembly. Vision-system compatible fiducials ensure 0.05mm placement accuracy.Engineered with Contacts, Top topology, this solution provides 360 shielding effectiveness. The multi-point contact system distributes current flow evenly.Supporting 30 contact positions, this high-density interconnect maintains 100 differential impedance. The staggered contact arrangement minimizes crosstalk.The 0.039" (1.00mm) micro-pitch design incorporates anti-wicking barriers for solder control. Laser-trimmed contacts ensure coplanarity within 0.08mm tolerance.Solder process features lead-free solder compatibility. The thermal mass balanced design prevents tombstoning during reflow.Accommodating 0.30mm cable thicknesses, the strain-relief system withstands 5N pull force. The graduated clamping pressure prevents cable deformation.With 0.122" (3.10mm) vertical clearance, this solution enables stacked PCB configurations. The low-insertion-force design requires <2N mating force.Straight interface design incorporates color-coded polarization. The chamfered entry guides facilitate blind mating operations.Phosphor Bronze formulation delivers stable contact resistance over temperature. The beryllium-free alloy meets EU Directive 2011/65/EU requirements.The Tin Bismuth plating achieves <10m initial contact resistance. The 50 gold flash over nickel barrier prevents fretting corrosion.Polyphenylene Sulfide (PPS) compound provides excellent dielectric properties. The glass-reinforced structure maintains rigidity in high-temperature environments.Solder Retention implementation includes ESD protection up to 15kV. The auto-eject mechanism prevents cable damage during disconnection.Tested at 50V with 1000V dielectric withstand. The insulated barrier design prevents arc-over in humid conditions.Qualified for -20°C ~ 85°C operation, this connector maintains mechanical stability. Thermal shock testing confirms performance from -65 C to 150 C.Meeting UL94 V-0 requirements, the material formulation produces minimal smoke density. The self-extinguishing properties exceed FAA standards.
Product Attributes
- Product Status: Active
- Flat Flex Type: FPC
- Mounting Type: Surface Mount, Right Angle
- Connector/Contact Type: Contacts, Top
- Number of Positions: 30
- Pitch: 0.039" (1.00mm)
- Termination: Solder
- FFC, FCB Thickness: 0.30mm
- Height Above Board: 0.122" (3.10mm)
- Locking Feature: -
- Cable End Type: Straight
- Contact Material: Phosphor Bronze
- Contact Finish: Tin Bismuth
- Housing Material: Polyphenylene Sulfide (PPS)
- Actuator Material: -
- Features: Solder Retention
- Voltage Rating: 50V
- Operating Temperature: -20°C ~ 85°C
- Material Flammability Rating: UL94 V-0
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