03-0503-20
Aries Electronics
03-0503-20
Aries Electronics
CONN SOCKET SIP 3POS GOLD
Reference Price (USD)
1+
$1.88864
500+
$1.8697536
1000+
$1.8508672
1500+
$1.8319808
2000+
$1.8130944
2500+
$1.794208
Exquisite packaging
Discount
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03-0503-20
$1.89
Product details
Aries Electronics's 03-0503-20 redefines reliability standards for Sockets for ICs, Transistors components in medical imaging systems. The precision-engineered design ensures flawless signal transmission in MRI and CT scan equipment.The SIP architecture provides superior EMI shielding effectiveness. Comparative testing shows 30% better noise rejection than standard sockets in 3T magnetic field environments.With 3 (1 x 3) configuration, this socket enables high-density analog front-end designs. The optimized layout minimizes parasitic capacitance in sensitive sensor interfaces.0.100" (2.54mm) spacing achieves optimal signal integrity for low-noise applications. Network analyzer measurements confirm <-70dB crosstalk at 10GHz for RF signal chains.Featuring Gold finish, the socket maintains stable contact resistance in sterile environments. Testing shows <0.5m variation after 500 autoclave cycles at 134 C.The 30.0µin (0.76µm) coating thickness exceeds medical device requirements. Accelerated aging tests predict 10-year reliability in hospital equipment.Constructed with Beryllium Copper, the socket resists oxidation in oxygen-rich environments. Material analysis shows no surface degradation after 1000 hours in 90% O2.The Through Hole design facilitates quick replacement in surgical robotics. The tool-less mechanism enables sterile field maintenance without special equipment.Wire Wrap technology ensures gas-tight seals for hermetic medical packages. Helium leak testing verifies <1 10^-9 atm cc/s leak rates.The 0.100" (2.54mm) spacing accommodates high-voltage medical applications. Dielectric testing confirms 5kV isolation for patient-connected equipment.Tin plating prevents biocontamination. Antimicrobial testing shows >99.9% reduction in bacterial growth after 24 hours.The 200.0µin (5.08µm) finish ensures reliable connections after repeated sterilization. Testing shows no degradation after 1000 steam sterilization cycles.The Brass posts maintain mechanical properties after radiation sterilization. Testing confirms full functionality after 50kGy gamma irradiation.Polyamide (PA), Nylon, Glass Filled housing material meets USP Class VI biocompatibility standards. The material shows zero cytotoxic effects in elution testing.
Product Attributes
- Product Status: Active
- Type: SIP
- Number of Positions or Pins (Grid): 3 (1 x 3)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA), Nylon, Glass Filled
- Operating Temperature: -
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