01-0503-31
Aries Electronics
01-0503-31
Aries Electronics
CONN SOCKET SIP 1POS GOLD
Reference Price (USD)
1+
$0.91098
500+
$0.9018702
1000+
$0.8927604
1500+
$0.8836506
2000+
$0.8745408
2500+
$0.865431
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
01-0503-31
$0.91
Product details
Aries Electronics's 01-0503-31 represents the next generation of Sockets for ICs, Transistors solutions, optimized for industrial IoT applications. The innovative design incorporates multiple reliability enhancements while maintaining backward compatibility with legacy systems.The SIP architecture provides unparalleled flexibility for prototype development. System designers can leverage multiple configuration options to optimize signal paths in mixed-signal circuits.Configured with 1 (1 x 1), this socket supports complex ASIC programming. The symmetrical pin distribution minimizes propagation delay variations in high-speed memory interfaces.Gold surface treatment delivers exceptional wear resistance. Accelerated aging tests show <5% contact resistance change after 1,000 thermal cycles.The 30.0µin (0.76µm) coating thickness exceeds telecom industry requirements. This ensures stable contact impedance in base station power amplifiers.Beryllium Copper contact material provides optimal stress relaxation properties. Finite element analysis confirms consistent normal force throughout the product lifecycle.The Through Hole design facilitates rapid field replacement in harsh environments. This feature reduces maintenance downtime in offshore wind turbine applications.Wire Wrap technology enables gas-tight connections for hermetic packaging. This is essential for aerospace avionics operating at altitude.Gold plating prevents intermetallic growth in high-temperature environments. This extends service life in downhole drilling equipment.The 30.0µin (0.76µm) finish guarantees reliable connections in vibrating environments. Vibration testing at 20G shows zero contact interruptions.Using Brass for posts ensures compatibility with press-fit assembly. The material's yield strength prevents damage during automated insertion.Polyamide (PA), Nylon, Glass Filled construction provides UV resistance for outdoor applications. The material retains 95% of tensile strength after 5,000 hours of UV exposure.
Product Attributes
- Product Status: Active
- Type: SIP
- Number of Positions or Pins (Grid): 1 (1 x 1)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA), Nylon, Glass Filled
- Operating Temperature: -
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