01-0503-20
Aries Electronics
01-0503-20
Aries Electronics
CONN SOCKET SIP 1POS GOLD
Reference Price (USD)
1+
$0.66659
500+
$0.6599241
1000+
$0.6532582
1500+
$0.6465923
2000+
$0.6399264
2500+
$0.6332605
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
01-0503-20
$0.67
Product details
Aries Electronics's 01-0503-20 enables next-generation Sockets for ICs, Transistors solutions for quantum computing applications. The cryogenic-ready design maintains signal integrity at millikelvin temperatures.The SIP architecture provides ultra-low thermal conductivity. Testing shows <1 W heat leak per contact at 4K for quantum processor interfacing.With 1 (1 x 1), the socket supports complex qubit control. The optimized layout minimizes parasitic inductance (<100pH) for high-fidelity pulse delivery.Featuring Gold finish, the socket maintains superconductive properties. Resistance measurements show <10^-8 contact resistance at 4.2K.The 30.0µin (0.76µm) coating ensures thermal matching. CTE measurements show <1ppm/K difference to silicon substrates.Constructed with Beryllium Copper, the socket minimizes magnetic susceptibility. SQUID measurements show <10^-8 emu/g at 4K.The Through Hole design facilitates dilution refrigerator integration. Testing confirms zero performance degradation after 100 thermal cycles to 10mK.Wire Wrap technology ensures minimal thermal noise. Johnson noise measurements show <0.1nV/ Hz contribution at 4K.Tin plating prevents oxidation in ultra-high vacuum. XPS analysis shows <0.1nm oxide after 1000 hours at 10^-10 Torr.The 200.0µin (5.08µm) finish ensures reliable connections in vacuum. Testing shows no outgassing products detectable by RGA.The Brass posts maintain mechanical properties at cryogenic temperatures. Testing shows <0.1% elastic modulus change from 300K to 4K.Polyamide (PA), Nylon, Glass Filled housing material provides radiopure construction. Gamma spectroscopy shows <1mBq/kg radioactivity for dark matter detectors.
Product Attributes
- Product Status: Active
- Type: SIP
- Number of Positions or Pins (Grid): 1 (1 x 1)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: -
- Termination: Wire Wrap
- Pitch - Post: -
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
- Housing Material: Polyamide (PA), Nylon, Glass Filled
- Operating Temperature: -
You May Also Be Interested In