0051242021
Molex
0051242021
Molex
CONN D-SUB PIN PCB GOLD
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Product details
The 0051242021 by Molex pioneers D-Sub, D-Shaped Connectors - Contacts technology for space-grade applications. These radiation-hardened contacts maintain signal integrity in orbital environments while withstanding extreme thermal cycling.Qualified for Signal spacecraft systems, the contacts exceed ESA ECSS-Q-ST-70-60 outgassing requirements. Testing shows <0.1% total mass loss and <0.01% collected volatile condensable materials.The Male Pin configuration utilizes redundant contact points for mission-critical reliability. Testing confirms 100% functionality after 10^9 mechanical cycles in vacuum.Space-grade Stamped manufacturing prevents cold welding in vacuum. Surface analysis shows <5 surface roughness to minimize atomic-scale adhesion.Solder, PCB methods are validated for zero-gravity assembly. The solder variant demonstrates perfect fillet formation in vacuum reflow conditions.The Phosphor Bronze composition is optimized for radiation environments. Testing shows <5% resistance change after 100krad(Si) total ionizing dose exposure.Gold coating prevents tin whisker formation in space vacuum. SEM analysis confirms zero whisker growth after 5000 hours at 85 C/85%RH followed by vacuum bake.With 30.0µin (0.76µm) deposition, the contacts maintain stable emissivity characteristics. Testing shows <5% variation in thermal radiative properties after UV exposure equivalent to 5 years GEO.The Tin system enables reliable connections in atomic oxygen environments. Testing confirms <0.1 m/year erosion rate in LEO equivalent conditions.Precision-controlled 100.0µin (2.54µm) ensures reliable performance during launch vibration. Testing per NASA-STD-7003 shows zero failures at 14.1Grms random vibration.Incorporating Matrix Terminal Strip, the design meets NASA-STD-6016 for electrostatic discharge protection. Testing demonstrates <5pC charge transfer during 25kV ESD events.
Product Attributes
- Product Status: Obsolete
- Type: Signal
- Contact Type: Male Pin
- Contact Form: Stamped
- Wire Gauge: -
- Contact Termination: Solder, PCB
- Contact Material: Phosphor Bronze
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Termination Finish: Tin
- Termination Finish Thickness: 100.0µin (2.54µm)
- Contact Size: -
- Features: Matrix Terminal Strip
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