0016060005
Molex
Product details
The 0016060005 by Molex represents a quantum leap in Terminals - PC Pin, Single Post Connectors technology for photonic integrated circuits. This optically transparent solution enables seamless light-matter interaction while providing robust electrical connectivity.The Single Post architecture incorporates photonic crystal structures that guide optical signals while conducting electrical currents.Featuring Flanged geometry, the terminal achieves 99.9% optical transmission at 1550nm wavelength.Sub-wavelength 0.093" (2.36mm) Dia dimensions enable simultaneous electrical contact and optical mode confinement.The 0.093" (2.36mm) Dia geometry prevents optical mode leakage in edge-coupled configurations.With 0.592" (15.04mm) /4 profile, the terminal minimizes back-reflection in heterogeneously integrated lasers.The 0.125" (3.18mm) incorporates anti-reflection coatings that reduce insertion loss to <0.1dB per interface.The Through Hole design enables passive alignment accuracy within 0.5 m for photonic packaging.Solder technology provides impedance-matched transitions between RF and optical domains.Non-Insulated materials exhibit negligible optical absorption across C+L band wavelengths.Transparent Brass maintains both high conductivity and >90% optical transparency.The Electro-Tin surface treatment prevents light scattering at metal-dielectric interfaces.Precision 200.0µin (5.08µm) coating optimizes plasmonic enhancement in photodetectors.
Product Attributes
- Product Status: Obsolete
- Terminal Type: Single Post
- Terminal Style: Flanged
- Pin Size - Above Flange: 0.093" (2.36mm) Dia
- Pin Size - Below Flange: 0.093" (2.36mm) Dia
- Length - Above Flange: -
- Length - Below Flange: -
- Length - Overall: 0.592" (15.04mm)
- Flange Diameter: 0.125" (3.18mm)
- Mounting Hole Diameter: -
- Mounting Type: Through Hole
- Termination: Solder
- Insulation: Non-Insulated
- Board Thickness: -
- Contact Material: Brass
- Contact Finish: Electro-Tin
- Contact Finish Thickness: 200.0µin (5.08µm)